DIPS-11/10

In terms of hardware manufacturing, Hitachi was in charge of the DIPS-11/10 (prototype completed in September 1975), NEC was in charge of the DIPS-11/20 (prototype completed in November 1975), and Fujitsu was in charge of the high-end model, the DIPS-11/30 (prototype completed in June 1976). Systems with an outstanding cost-performance ratio were achieved by using component technologies that were advanced for that time, such as highly integrated logic elements and IC memory (see "DIPS-11/10 Series Main Specifications").