Dr. Richard (Dick) Chao-Fan Chu

Born in Beijing, China, he was the son of Liang-Hsi Chu and Yun Hwa Wang. He received his Bachelor of Science Degree in Mechanical Engineering from National Cheng-Kung University in 1958 and his Master's Degree in Mechanical Engineering from Purdue University in 1960. He was the recipient of two Honorary Doctorate degrees; in 1992 from American University of the Caribbean and in 1996 from his alma mater, Purdue University. He was recognized by both National Cheng-Kung and Purdue University as a Distinguished Alumnus. He joined IBM in 1960 and held a variety of both technical and managerial assignments (all in Development Lab, IBM Poughkeepsie, New York). He was appointed in 1983 as an IBM Fellow, IBM's highest technical honor. In his distinguished career, his invention achievements are documented in over 200 patents and over 150 patent disclosure publications. A prolific technical innovator in cooling technology, many of his patents and publications have been recognized outside of IBM as industry standards for the cooling of electronic equipment. He has achieved numerous honors, including the ASME Heat Transfer Memorial Award in 1986, election to the National Academy of Engineering in 1987 and his appointment to Academia Sinica, Republic of China in 1996. He served as the first president of the IBM Academy of Technology and was recognized by the Organization of Chinese Americans (OCA) as Asian American Engineer of the Year in 2006. In 2010, he received his 66th Invention Achievement Award, at that time a record for IBM Poughkeepsie. He had a lifelong passion for the academic community, as shown by his active involvement in IBM's university research program which resulted in over 80 thesis related publications. He retired in 2011 after 51 years of dedicated service to IBM. He remained an IBM Fellow Emeritus and still maintained a strong presence at IBM even in his retirement. On August 24, 1963 in Newark, NJ, he married Theresa Lee and they had four children.