• 2011

Hardware Description

Including the unique Thermal Conductive Technology, each memory chip's surface makes direct contact with the heat sink to maintain ICs and the PCB operate at a low temperature, thus ensuring the memory module retains ultimate stability while delivering supremely high performance. The ADATA XPG Gaming v2.0 Series adopts the extruded heat sink that extends to increase surface area, providing superior thermo-conduct capability, efficiently reducing power consumption and greatly elevating the signal completion emitted from the memory module. Further, the Gaming v2.0 employs the industry-leading 2OZ double-copper PCB, increasing stability while the memory is in use.