Mr. Jon Casey

A 2013 IBM Fellow, he has been a strategic and tactical innovator in semiconductor packaging and chip package interaction technologies, which have become so prominent in generating data in today's connected world. He has contributed to IBM?s development of the industry?s highest performing organic packaging solutions. These are now the basis for all future IBM systems processors, including the most recent p7+ dual-chip module. Over his career, he has done groundbreaking work in developing and implementing multilayer ceramic packaging technologies ? including the High Performance Glass Ceramic crystallization mechanism, binder removal catalysts, raw material development, and green sheet fabrication ?- that have helped IBM systems lead the industry for more than 20 years. He will serve as technology ambassador to Ethiopia.